Bond Information

The Company issued bonds twice, the first issuance was Shelf-Registered Bonds I Phase I of Timah Year 2017 Series A and Series B on September 28, 2017, with maturity dates of September 28, 2020, for Series A and September 28, 2022, for Series B. The second issuance was Shelf-Registered Bonds I Phase II of Timah Year 2019 Series A and Series B on August 15, 2019, with maturity dates of August 15, 2022, for Series A and August 15,
2024, for Series B.

Furthermore, the Company also issued Sukuk Ijarah twice; the first issuance was Shelf-Registered Sukuk Ijarah I Phase I of Timah Year 2017 Series A and Series B on September 28, 2017, with maturity dates of September 28, 2020, for Series A and September 28, 2022, for Series B. The second issuance was Shelf-Registered Sukuk Ijarah I Phase II of Timah Year 2019 Series A on August 15, 2019, with a maturity date of August 15, 2024. Both the bonds and sukuk ijarah had been fully settled according to their respective maturity dates, as detailed in the Company Profile section of this Annual Report. 

Therefore, there is no outstanding information regarding bonds, sukuk, and/or convertible bonds in this Annual Report.

Nama Instrumen Keuangan (Name of Financial Instrument) Outstanding (Rp) Rating Tanggal Jatuh tempo (Due Date) Rate (%)
Bond Informtion Is Not Yet Available